PriceList for Silicone Mold Making - High Temperature Ressitance SLA Resin ABS like KS1208H – JS ADDITIVE Detail:
Advantages
High temperature resistance
Excellent dimensional stability
High strength and accuracy
Ideal Applications
Prototypes need high-temp resistance
Quick mold
Technical Data-sheet
| Liquid Properties | Optical Properties | |||
| Appearance | Semi-translucent | Dp | 13.5 mJ/cm2 | [critical exposure] |
| Viscosity | 340 cps@30℃ | Ec | 0.115 mm | [slope of cure-depth vs. In (E) curve] |
| Density | 1.14 g/cm3 | Building layer thickness | 0.08-0.12 mm | |
| Mechanical properties | UV post curing | |||
| Test items | Test Methods | Numerical value | Test Methods | Numerical value |
| Tensile Strength | ASTMD 638 | 65MPa | GB/T1040.1-2006 | 71MPa |
| Elongation at break | ASTMD 638 | 3-5% | GB/T1040.1-2006 | 3-5% |
| Bending strength | ASTMD 790 | 110MPa | GB/ T9341-2008 | 115MPa |
| Flexural modulus | ASTMD 790 | 2720MPa | GB/ T9341-2008 | 2850MPa |
| Izod notched impact strength | ASTMD 256 | 20J/m | GB/T1843-2008 | 25J/m |
| Shore hardness | ASTMD 2240 | 87D | GB/T2411-2008 | 87D |
| Glass transition temperature | DMA, tan θ peak | 135℃ | ||
| Thermal expansion coefficient（25-50℃） | ASTME831-05 | 50 µ m/m℃ | GB/T1036-89 | 50 µ m/m℃ |
| Thermal expansion coefficient（50-100℃） | ASTME831-05 | 150 µ m/m℃ | GB/T1036-89 | 160 µ m/m℃ |
Recommended temperature for processing and storage of the above resin should be 18℃-25℃.
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